Hong Kong to Auction 10-Year RMB Institutional Government Bonds

The Hong Kong Monetary Authority (HKMA), acting on behalf of the Hong Kong Special Administrative Region Government, has announced a tender for 10-year RMB Institutional Government Bonds. This event is scheduled for Tuesday, May 13, 2025, with settlement set for May 15, 2025, according to the Hong Kong Monetary Authority.

Details of the Bond Issuance

The HKMA will offer a total of RMB1.0 billion in bonds, which will mature on May 15, 2035. These bonds will carry an interest rate of 2.29% per annum, payable semi-annually. The tender is exclusively open to Primary Dealers appointed under the Infrastructure Bond Programme.

Each tender must be for an amount of RMB50,000 or integral multiples thereof. Interested parties can apply through any Primary Dealer listed on the Hong Kong Government Bonds website.

Publication of Tender Results

The results of the tender will be published on multiple platforms, including the HKMA’s website, the Hong Kong Government Bonds website, Bloomberg (GBHK <GO>), and Refinitiv (IBPGSBPINDEX). The publication is expected no later than 3:00 pm on the tender day.

Additional Information and Bond Usage

The issued bonds are part of the institutional section of the Infrastructure Bond Programme, with proceeds designated for investment in infrastructure projects as outlined in the Infrastructure Bond Framework. The expected commencement date for dealing on the Stock Exchange of Hong Kong Limited is May 16, 2025.

For more detailed information, potential applicants and interested parties are encouraged to refer to the Information Memorandum available on the Hong Kong Government Bonds website or consult with Primary Dealers.

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